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High-performance DualPack 3 IGBT7 Modules offer compact power concentration and streamline system assembly processes

Innovative Power Modules Introduced by Microchip Technology: The DualPack 3 (DP3) Series Embraces Cutting-edge IGBT7 Technology.

High-Power Density IGBT7 Modules in the New DualPack 3 Streamline System Integration
High-Power Density IGBT7 Modules in the New DualPack 3 Streamline System Integration

High-performance DualPack 3 IGBT7 Modules offer compact power concentration and streamline system assembly processes

Microchip Technology, a leading semiconductor solutions provider, has introduced a new range of DualPack 3 (DP3) power modules. These modules, available in six variants at 1200V and 1700V, deliver high-current capabilities ranging from 300-900A.

The DP3 power modules are designed to tackle common challenges in general-purpose motor drive applications, such as dv/dt, driving complexity, higher conduction losses, and lack of overload capability. They are engineered to operate reliably at higher temperatures, up to 175°C during overload.

A key feature of the DP3 modules is the use of the latest IGBT7 technology. This technology is designed to reduce power losses by up to 15-20% compared to IGBT4 devices, enhancing performance and efficiency.

Leon Gross, corporate vice president of Microchip's high-reliability and RF business unit, notes that the DualPack 3 power modules with IGBT7 technology can simplify design and lower system costs while maintaining high performance.

The DP3 modules can be integrated as part of a comprehensive system solution alongside Microchip's microcontrollers, microprocessors, security, connectivity, and other components, accelerating development and time to market.

Microchip offers a wide portfolio of power management solutions, including analog devices, Silicon (Si) and Silicon Carbide (SiC) power technologies, dsPIC Digital Signal Controllers (DSCs), and standard, modified, and custom power modules. The DP3 modules are available in a phase-leg configuration, enabling a frame size jump for increased power output.

Moreover, the compact footprint of approximately 152 mm × 62 mm × 20 mm eliminates the need for paralleling multiple modules, helping reduce system complexity and Bill of Materials (BOM) costs. The DP3 modules also provide a second-source option to industry-standard EconoDUAL packages for greater flexibility and supply chain security for customers.

The newest DualPack 3 Power Modules with IGBT7 technology from Microchip Technology are primarily used in Germany in the industrial drives, renewables, traction, energy storage, and agricultural vehicle industries. These modules address the demand for compact, cost-effective, and simplified power converter solutions while enhancing performance and reliability in these sectors.

For detailed information about Microchip's power management products, visit their website. Microchip invites developers to explore the possibilities of the DP3 power modules and unlock the potential for high-performance, efficient, and reliable power solutions.

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