Dicing Blade Industry Likely to Expand to USD 487.2 Million by 2033 at an Annual Growth Rate of 3.80%
The global dicing blade market is witnessing significant growth, with Hubless Dicing Blades leading the charge with a dominating 61.7% market share. This market's Compound Annual Growth Rate (CAGR) from 2024 to 2033 is projected to be 3.80%, leading to an anticipated value of USD 487.2 million by 2033.
The Asia-Pacific region holds a substantial market share of 52.1%, currently valued at approximately USD 174.8 million in 2024. Key players in this region include Beijing Technol Science and Shanghai Sinyang Semiconductor Materials Co., Ltd., who have strengthened their foothold in the market.
The market's growth can be attributed to the growing preference for sustainable and eco-friendly materials in manufacturing processes, as well as the increasing adoption of advanced materials like polycrystalline diamond (PCD) and ceramic-based blades due to technological advancements in material science.
In 2024, DISCO Corporation made a significant stride by launching two new dicing blades: the ZHSC25 Series for SiC and the Z25 Series for electronic components. Other key players, such as Disco Corporation, Advanced Dicing Technologies, and Kulicke & Soffa Industries, Inc., are recognised for their advanced dicing technologies in the semiconductor industry.
Dicing blades are extensively used in various sectors, including semiconductor manufacturing, LED and solar panel production, medical device manufacturing, electronic component fabrication, and packaging and assembly in electronics. As the miniaturization of electronic devices continues, the market is seeing the development of specialized dicing blades for high-precision cutting jobs.
The dicing blade market is also benefiting from the growing demand in the electronics and renewable energy sectors, with companies like Engis Corporation and Meyer Burger Technology AG offering high-performance blades for diverse applications.
Smart dicing blades, which can be monitored and controlled via Internet of Things (IoT) devices, are gaining traction as well. In 2025, NTT DATA unveiled its annual report, NTT DATA Technology Foresight 2025, highlighting emerging technology trends, further underscoring the importance of smart technologies in the dicing blade market.
Moreover, the market is expected to thrive, driven by the need for high-performance, cost-effective cutting solutions in increasingly miniaturized and complex electronic devices. In November 2024, Kulicke & Soffa Industries, Inc. announced a significant order from a leading foundry customer for multiple APTURATM Fluxless TCB systems, demonstrating the market's potential.
Established manufacturers like Kinik Company, Asahi Diamond Industrial Co., Ltd., and Kasco Abrasives continue to enhance their product offerings in the dicing blade market, catering to the growing demand for sustainable, advanced, and smart dicing solutions.
In 2025, ROHM introduced the 650V GaN HEMT, a new component designed for high-power applications in industrial and automotive systems, further expanding the scope of the dicing blade market. As the market continues to evolve, it is clear that the future holds exciting opportunities for both manufacturers and consumers alike.
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